As electronic devices grow more compact and powerful, servers and power components face mounting heat dissipation challenges. Traditional manufacturing struggles with intricate cooling structures, while additive manufacturing, represented by Laser Powder Bed Fusion (LPBF), can directly fabricate complex flow channels and shorten R&D cycles, emerging as a prime solution for cooling components.
Conventional Al-Si alloy powders like AlSi10Mg, widely used in 3D printing, only deliver a thermal conductivity of around 130 W/(m·K), failing to meet the demands of high-power devices. Though copper alloys offer superior heat conduction, they strongly reflect infrared lasers and require costly green laser equipment for stable printing. In contrast, aluminum alloys are fully compatible with mainstream infrared laser 3D printers, boasting lower overall costs and better process adaptability.
To break the thermal conductivity bottleneck of aluminum alloys, Jinyuan Intelligent has launched two high-thermal-conductivity aluminum alloy powders: IMT-Al 200 and IMT-61. Balancing outstanding heat conduction, lightweight properties and excellent formability for complex structures, these two materials have greatly outperformed traditional 3D-printable aluminum alloys in thermal performance. They have been applied to manufacture sophisticated cooling parts for aerospace and 3C electronics, and have passed customer validation.
